Pliant Completes USD 80 Million Series C Funding Round to Advance AI Payments

According to 深潮 TechFlow, on November 5, Pliant announced that the Berlin-based fintech company Pliant completed a USD 80 million Series C funding round, led by Seaya Nova and Speedinvest, with participation from Illuminate Financial, Motive Partners and Molten Ventures.

The company said the funding will be used to continue expanding in the United States and Canada, prepare for entry into more international markets, and accelerate its AI payments roadmap. Pliant provides enterprise payment infrastructure, and its platform can connect third-party AI agents through the Model Context Protocol (MCP) to embed payment workflows into business operations.

Pliant said its business has doubled for three consecutive years, with annual recurring revenue exceeding USD 100 million.

Source: 深潮 TechFlow